Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration

K. W. Lee, C. Nagai, J. C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi, R. Suresh, X. Wu Xilinx

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of untra-fine size, ultra-high density CNP. Multi-number of TEG dies with 7mm x 23mm size are bonded to an interposer wafer by a new hybrid bonding technology. A huge number of electrodes of 4,309,200 composed of scaled electrodes with 3μm diameter and 6μm pitch are formed in each TEG die. We confirmed for the first time that 4,309,200 electrodes per die are successfully connected in series with the joining yield of 100% due to ultra-high density CNP.

Original languageEnglish
Title of host publicationProceedings - ECTC 2016
Subtitle of host publication66th Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages350-355
Number of pages6
ISBN (Electronic)9781509012039
DOIs
Publication statusPublished - 2016 Aug 16
Event66th IEEE Electronic Components and Technology Conference, ECTC 2016 - Las Vegas, United States
Duration: 2016 May 312016 Jun 3

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2016-August
ISSN (Print)0569-5503

Other

Other66th IEEE Electronic Components and Technology Conference, ECTC 2016
CountryUnited States
CityLas Vegas
Period16/5/3116/6/3

Keywords

  • Cu nano-pillar (CNP)
  • Exascale 2.5D/3D integration
  • Extruded electrode
  • Hybrid bonding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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