Novel sputtering process to reduce the grain size and its distribution in Co based longitudinal thin film media - new seedlayer and high KU GRAIN material-

Migaku Takahashi, Hiroki Shoji, D. D. Djayaprawira, Satoru Yoshimura

    Research output: Contribution to journal › Conference article › peer-review

    Fingerprint

    Dive into the research topics of 'Novel sputtering process to reduce the grain size and its distribution in Co based longitudinal thin film media - new seedlayer and high KU GRAIN material-'. Together they form a unique fingerprint.

    Chemistry

    Engineering

    Physics

    Material Science