This study is aimed at reducing the grain size and its distribution in Co-based longitudinal film media using the UC process as infrastructure. Proposed are two kinds of techniques. The first is the use of Co co-precipitated NiP/Al-alloy substrate (Co-NiP substrate). To reduce the grain size of Cr underlayer grown onto the substrate surface, oxygen exposure is introduced to increase the density of nucleation sites. The second is the use of a very thin W54Cr46 alloy seedlayer combined with dry-etching process. In this concept, the island-like structure at the initial layer is enhanced using a material with high melting point such as W. These techniques are expected to be useful in controlling the density of the nucleation sites of the initial film layer.
|Journal||Digests of the Intermag Conference|
|Publication status||Published - 2000 Jan 1|
|Event||2000 IEEE International Magnetics Conference-2000 IEEE INTERMAG - Toronto, Ont, Can|
Duration: 2000 Apr 9 → 2000 Apr 13
ASJC Scopus subject areas
- Electrical and Electronic Engineering