Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding

T. Saito; H. Makita; T. Moriwaki; Y. Suzuki; N. Kato; S. Wakayanagi; A. Miura; M. Uomoto; T. Shimatsu

doi:10.23919/LTB-3D.2019.8735262

Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding

T. Saito, H. Makita, T. Moriwaki, Y. Suzuki, N. Kato, S. Wakayanagi, A. Miura, M. Uomoto, T. Shimatsu

Advanced Interdisciplinary Research Division

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

SiO films were deposited on glass wafers using energy treatment sputtering (ETS). Surface roughness S of ETS-SiO film was 0.17 nm, which is remarkably smaller than that of films deposited using conventional sputtering (Sa=0.46 nm). Bonding using the extremely smooth surface was demonstrated.

Original language	English
Title of host publication	Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	64
Number of pages	1
ISBN (Electronic)	9784904743072
DOIs	https://doi.org/10.23919/LTB-3D.2019.8735262
Publication status	Published - 2019 May
Event	6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan Duration: 2019 May 21 → 2019 May 25

Publication series

Name	Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference	6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Country/Territory	Japan
City	Kanazawa, Ishikawa
Period	19/5/21 → 19/5/25

ASJC Scopus subject areas

Process Chemistry and Technology
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

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10.23919/LTB-3D.2019.8735262

Cite this

Saito, T., Makita, H., Moriwaki, T., Suzuki, Y., Kato, N., Wakayanagi, S., Miura, A., Uomoto, M., & Shimatsu, T. (2019). Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 (pp. 64). [8735262] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735262

Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding. / Saito, T.; Makita, H.; Moriwaki, T. et al.

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 64 8735262 (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Saito, T, Makita, H, Moriwaki, T, Suzuki, Y, Kato, N, Wakayanagi, S, Miura, A, Uomoto, M & Shimatsu, T 2019, Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding. in Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019., 8735262, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Institute of Electrical and Electronics Engineers Inc., pp. 64, 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Kanazawa, Ishikawa, Japan, 19/5/21. https://doi.org/10.23919/LTB-3D.2019.8735262

Saito T, Makita H, Moriwaki T, Suzuki Y, Kato N, Wakayanagi S et al. Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 64. 8735262. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). doi: 10.23919/LTB-3D.2019.8735262

Saito, T. ; Makita, H. ; Moriwaki, T. et al. / Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding. Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 64 (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

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title = "Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding",

abstract = "SiO films were deposited on glass wafers using energy treatment sputtering (ETS). Surface roughness S of ETS-SiO film was 0.17 nm, which is remarkably smaller than that of films deposited using conventional sputtering (Sa=0.46 nm). Bonding using the extremely smooth surface was demonstrated.",

author = "T. Saito and H. Makita and T. Moriwaki and Y. Suzuki and N. Kato and S. Wakayanagi and A. Miura and M. Uomoto and T. Shimatsu",

note = "Publisher Copyright: {\textcopyright} 2019 JSPS 191st Committee on Innovative Interface Bonding Technology.; 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 ; Conference date: 21-05-2019 Through 25-05-2019",

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doi = "10.23919/LTB-3D.2019.8735262",

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AU - Saito, T.

AU - Makita, H.

AU - Moriwaki, T.

AU - Suzuki, Y.

AU - Kato, N.

AU - Wakayanagi, S.

AU - Miura, A.

AU - Uomoto, M.

AU - Shimatsu, T.

PY - 2019/5

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N2 - SiO films were deposited on glass wafers using energy treatment sputtering (ETS). Surface roughness S of ETS-SiO film was 0.17 nm, which is remarkably smaller than that of films deposited using conventional sputtering (Sa=0.46 nm). Bonding using the extremely smooth surface was demonstrated.

AB - SiO films were deposited on glass wafers using energy treatment sputtering (ETS). Surface roughness S of ETS-SiO film was 0.17 nm, which is remarkably smaller than that of films deposited using conventional sputtering (Sa=0.46 nm). Bonding using the extremely smooth surface was demonstrated.

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Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding

Abstract

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