Novel retinal prosthesis system with three dimensionally stacked LSI chip

T. Watanabe, H. Kikuchi, T. Fukushima, H. Tomita, E. Sugano, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

We have proposed a novel retinal prosthesis system with three-dimensionally stacked retinal prosthesis chip. The retinal prosthesis chip consists of several LSI chips that are vertically stacked and electrically connected using three-dimensional integration technology. We fabricated retinal prosthesis chip including photodetectors and stimulus current generators. We confirmed that current waveform parameters can be varied by bias voltages. Implantable stimulus electrode array was also fabricated for the electrical stimulation of the retina. To evaluate optimal retinal stimulus current, electrically evoked potential (EEP) was recorded in animal experiments. The recorded waveform shows a similar behavior to the visually evoked potential (VEP) waveform, indicating possibilities that the electrical stimulation of the retina can restore visual sensation for the blind patients.

Original languageEnglish
Title of host publicationESSDERC 2006 - Proceedings of the 36th European Solid-State Device Research Conference
PublisherIEEE Computer Society
Pages327-330
Number of pages4
ISBN (Print)1424403014, 9781424403011
DOIs
Publication statusPublished - 2006
EventESSDERC 2006 - 36th European Solid-State Device Research Conference - Montreux, Switzerland
Duration: 2006 Sep 192006 Sep 21

Publication series

NameESSDERC 2006 - Proceedings of the 36th European Solid-State Device Research Conference

Other

OtherESSDERC 2006 - 36th European Solid-State Device Research Conference
CountrySwitzerland
CityMontreux
Period06/9/1906/9/21

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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