Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration

K. W. Lee, C. Nagai, J. C. Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

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