We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of a current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of ultra-high density CNP. Test element group (TEG) dies with 7-mm × 23 mm size are bonded to interposer wafer by a new hybrid bonding technology. Scaled electrodes with 3 μm diameter and 6 μm pitch are formed in each TEG chip. We confirmed for the first time that a huge number of electrodes of 4 309 200 are successfully connected in series with the joining yield of 100% due to the ultra-high density CNP.
- Cu nano-pillar (CNP)
- exascale 2.5D/3D integration
- extruded electrode
- hybrid bonding
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering