Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration

Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of a current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and unique adhesive layer of anisotropic conductive film composed of ultra-high density CNP. Test element group (TEG) dies with 7-mm × 23 mm size are bonded to interposer wafer by a new hybrid bonding technology. Scaled electrodes with 3 μm diameter and 6 μm pitch are formed in each TEG chip. We confirmed for the first time that a huge number of electrodes of 4 309 200 are successfully connected in series with the joining yield of 100% due to the ultra-high density CNP.

Original languageEnglish
Article number7332922
Pages (from-to)81-83
Number of pages3
JournalIEEE Electron Device Letters
Volume37
Issue number1
DOIs
Publication statusPublished - 2016 Jan

Keywords

  • Cu nano-pillar (CNP)
  • exascale 2.5D/3D integration
  • extruded electrode
  • hybrid bonding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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