Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration

Yuki Ohara, Kanuku Ri, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

We developed a novel detachable bonding process by controlling wettability of a bonding surface. A high hydrophobic surface was formed in the bonding area for adhesion blocking. We applied an adhesive material with high thermal resistance at around 350 °C. In this paper, the bonding characteristics of the novel detachable bonding process was estimated by evaluating the shear strength and the dissolution time of adhesive material varying the ratio of hydrophobic area to the hydrophilic area using 5 mm 2 size chip. Based on the evaluation results of the shear strength and the de-bonding time, 10 % of the hydrophilic area is suitable condition for our novel chip-level 3D integration process.

Original languageEnglish
Title of host publication2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan
Duration: 2012 Jan 312012 Feb 2

Publication series

Name2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Other

Other2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
CountryJapan
CityOsaka
Period12/1/3112/2/2

ASJC Scopus subject areas

  • Control and Systems Engineering

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    Ohara, Y., Ri, K., Fukushima, T., Tanaka, T., & Koyanagi, M. (2011). Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. In 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 [6262950] (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011). https://doi.org/10.1109/3DIC.2012.6262950