TY - GEN
T1 - Nondestructive inspection of chip size package by millimeter waves
AU - Ju, Yang
AU - Yamamoto, Hiroshi
AU - Saka, Masumi
PY - 2003/1/1
Y1 - 2003/1/1
N2 - Chip size package was inspected by millimeter waves. Millimeter wave image was created using the phase and amplitude of the reflection coefficient, measured by a network analyzer. To obtain a high spatial resolution, an open-ended coaxial line sensor was used. Solder bumps and delamination under the silicon chip of the package were observed effectively. It is shown that millimeter wave technique has a good prospect for integrity assessment of chip size package.
AB - Chip size package was inspected by millimeter waves. Millimeter wave image was created using the phase and amplitude of the reflection coefficient, measured by a network analyzer. To obtain a high spatial resolution, an open-ended coaxial line sensor was used. Solder bumps and delamination under the silicon chip of the package were observed effectively. It is shown that millimeter wave technique has a good prospect for integrity assessment of chip size package.
UR - http://www.scopus.com/inward/record.url?scp=1242264473&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1242264473&partnerID=8YFLogxK
U2 - 10.1115/ipack2003-35118
DO - 10.1115/ipack2003-35118
M3 - Conference contribution
AN - SCOPUS:1242264473
SN - 0791836908
SN - 9780791836903
T3 - Advances in Electronic Packaging
SP - 765
EP - 768
BT - Advances in Electronic Packaging 2003
PB - American Society of Mechanical Engineers
T2 - 2003 International Electronic Packaging Technical Conference and Exhibition
Y2 - 6 July 2003 through 11 July 2003
ER -