Nondestructive inspection of chip size package by millimeter waves

Yang Ju, Hiroshi Yamamoto, Masumi Saka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Chip size package was inspected by millimeter waves. Millimeter wave image was created using the phase and amplitude of the reflection coefficient, measured by a network analyzer. To obtain a high spatial resolution, an open-ended coaxial line sensor was used. Solder bumps and delamination under the silicon chip of the package were observed effectively. It is shown that millimeter wave technique has a good prospect for integrity assessment of chip size package.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging 2003
Subtitle of host publicationVolume 1
PublisherAmerican Society of Mechanical Engineers
Pages765-768
Number of pages4
ISBN (Print)0791836908, 9780791836903
DOIs
Publication statusPublished - 2003 Jan 1
Event2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, United States
Duration: 2003 Jul 62003 Jul 11

Publication series

NameAdvances in Electronic Packaging
Volume1

Other

Other2003 International Electronic Packaging Technical Conference and Exhibition
CountryUnited States
CityHaui, HI
Period03/7/603/7/11

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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