Nondestructive inspection of a small area delamination in IC packages by microwave imaging

Yang Ju, Masumi Saka, Hiroyuki Abé

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The delamination, which may occur between the chip pad and the encapsulant resin in IC packages, was inspected by microwave imaging technique. An open-ended coaxial line sensor was used to increase the spatial resolution of the measurement. The microwave image was generated using the measured amplitude of the reflection coefficient. The full and part delaminations were detected by the microwave amplitude image. The results were compared with those obtained by scanning acoustic tomography. The good inspection capability and no necessity of any coupling medium make this technique having wide prospects for the integrity assessment of IC packages.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging; Thermal Manegement Reliability
Pages1177-1181
Number of pages5
Publication statusPublished - 2001 Dec 1
EventPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition - Kauai, Hi, United States
Duration: 2001 Jul 82001 Jul 13

Publication series

NameAdvances in Electronic Packaging
Volume2

Other

OtherPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition
CountryUnited States
CityKauai, Hi
Period01/7/801/7/13

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering

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