Nondestructive evaluation of the delamination of fine bumps in three-dimensionally stacked flip chip structures

Yuhki Sato, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A new nondestructive evaluation method for detecting delamination between a chip and metallic bumps in areaarrayed flip chip structures has been developed by measuring the local surface deformation of a chip, which is caused by the mismatch in mechanical properties between the metallic bumps and underfill. The change of the local deformation was measured by using a high resolution laser displacement meter and it was confirmed that the 3 μm-thick delamination can be detected easily using the proposed method.

Original languageEnglish
Title of host publication2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
Pages1951-1956
Number of pages6
DOIs
Publication statusPublished - 2010 Aug 9
Event60th Electronic Components and Technology Conference, ECTC 2010 - Las Vegas, NV, United States
Duration: 2010 Jun 12010 Jun 4

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other60th Electronic Components and Technology Conference, ECTC 2010
CountryUnited States
CityLas Vegas, NV
Period10/6/110/6/4

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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