Nondestructive evaluation of delamination in IC packages by millimeter-waves

Yang Ju, M. Saka, H. Abé

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A method to evaluate delamination in IC packages by millimeter-wave technique was studied. An open-ended coaxial line sensor was used as source and also as receiver of millimeter-wave signal that was transmitted into and reflected from the packages. The phase of the reflection coefficient causes a shift due to the presence of the delamination. The phase shift of the reflection coefficient in the cases of with and without delamination was proposed to be used to evaluate the delamination.

Original languageEnglish
Title of host publication2000 25th International Conference on Infrared and Millimeter Waves - Conference Digest
EditorsShenggang Liu, Xuechu Shen, K. J. Button
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages421-422
Number of pages2
ISBN (Electronic)0780365135, 9780780365131
DOIs
Publication statusPublished - 2000 Jan 1
Event25th International Conference on Infrared and Millimeter Waves, IRMMW 2000 - Beijing, China
Duration: 2000 Sep 122000 Sep 15

Publication series

Name2000 25th International Conference on Infrared and Millimeter Waves - Conference Digest

Other

Other25th International Conference on Infrared and Millimeter Waves, IRMMW 2000
CountryChina
CityBeijing
Period00/9/1200/9/15

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation
  • Radiation

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