Non-destructive inspection system for bump joints in area-arrayed flip chip packaging structures

Yuki Sato, Hideo Miura

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A new nondestructive inspection method for detecting delaminated bump joints was proposed by measuring local surface deformation of a chip in area-arrayed flip chip structures. The local deformation of a chip appears because of the mismatch of coefficient of thermal expansion among structural materials. Both lack and delamination of a bump change this local deformation drastically. Irregular bump joints can be detected easily by measuring the change of amplitude and period of this local deformation. In this paper, signal processing methods for minimizing the errors caused by various noises are discussed using a finite element method to improve the accuracy of this inspection method. Finally, a nondestructive inspection system that consists of the developed algorithm for defect detection and a laser measurement unit was developed for the practical inspection.

Original languageEnglish
Pages (from-to)823-830
Number of pages8
JournalNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Volume75
Issue number755
DOIs
Publication statusPublished - 2009 Jul
Externally publishedYes

Keywords

  • Delamination
  • Finite element method
  • Flip chip package
  • Nondestructive inspection
  • Structural reliability
  • Thermal stress
  • White light interference microscope

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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