Non-conductive film underfill for 3D integration of 20 μm-thick LSI wafers with fine Cu-TSVs

M. Murugesan, J. C. Bea, M. Koyanagi, Y. Ito, T. Fukushima, T. Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The beneficial role played by non-conductive film (NCF) under-fill (UF) compared with the conventional capillary under fill (CUF) is meticulously investigated for the reliability issues in high-density 3D-integration at die/wafer-level. The NCF with co-efficient of thermal expansion (CTE) value of 35 ppm/°C tremendously reduces the local deformation of 20 pm-thick three-dimensionally (3D)-stacked LSI die/wafer. This reduces the local mechanical stress in thinned 3D-LSI by nearly 5 times as against the CUF with the CTE value of 60-70 ppm/C. Both μ-RS and μ-XRD data showed only ∼250 MPa of tensile stress on the back surface of 20 pm-thick stacked die/wafer with NCFUF, whereas it was more than five-times larger (∼1400 MPa) for CUF. μ-XRD data illustrates that the cause for residual stress in the bump-space region and above the μ-bump are respectively due to the lattice tilt and change in lattice space.

Original languageEnglish
Title of host publication2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages466-471
Number of pages6
ISBN (Electronic)9781509002702
DOIs
Publication statusPublished - 2016 Jun 13
Event27th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2016 - Saratoga Springs, United States
Duration: 2016 May 162016 May 19

Publication series

Name2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2016

Other

Other27th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2016
CountryUnited States
CitySaratoga Springs
Period16/5/1616/5/19

Keywords

  • NCF
  • Thermo-Mechanical Stress
  • μ-XRD

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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