Non-conductive film and compression molding technology for self-assembly-based 3D integration

T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

Two key technologies consisting of chip-to-wafer bonding through a non-conductive film (NCF) and wafer-level packaging using compression molding were studied for self-assembly-based 3D integration, especially reconfigured wafer-to-wafer stacking. 4-mm-by-5-mm chips having 20-μm-pitch Cu-SnAg microbumps were successfully bonded to wafers through NCF. The resulting daisy chain obtained from the chip-to-wafer structure showed low contact resistance of approximately 50 MΩ/bump. Compression molding was implemented to a chip-on-wafer structure. Grinding of the chip-on-wafer structure gave low total thickness variation (TTV) within 1 μm and the following CMP led good planarization capability.

Original languageEnglish
Title of host publication2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Pages393-398
Number of pages6
DOIs
Publication statusPublished - 2012
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States
Duration: 2012 May 292012 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
CountryUnited States
CitySan Diego, CA
Period12/5/2912/6/1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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