Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV

Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka

doi:10.1109/EDTM.2019.8731161

Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The effect of noise propagation from a digital circuit on an analog circuit was evaluated using an actual mixed-signal 3D-IC, which has a stacked structure of digital and analog IC chips. The noise propagation through the TSV was measured with a ring-oscillator as a noise source. To investigate in detail, TSV-liner interface states were evaluated along depth direction using unique multi-well-structured TSVs and charge-pumping method. It was considered that the interface traps and non-conformal thickness of TSV liner increased the noise propagation among stacked chips.

Original language	English
Title of host publication	2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	222-224
Number of pages	3
ISBN (Electronic)	9781538665084
DOIs	https://doi.org/10.1109/EDTM.2019.8731161
Publication status	Published - 2019 Mar
Event	2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 - Singapore, Singapore Duration: 2019 Mar 12 → 2019 Mar 15

Publication series

Name	2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019

Conference

Conference	2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
Country	Singapore
City	Singapore
Period	19/3/12 → 19/3/15

Keywords

3D-IC
Mixed signal
Noise
TSV

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Instrumentation
Hardware and Architecture

Access to Document

10.1109/EDTM.2019.8731161

Fingerprint Dive into the research topics of 'Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV'. Together they form a unique fingerprint.

Cite this

Kino, H., Fukushima, T., & Tanaka, T. (2019). Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV. In 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 (pp. 222-224). [8731161] (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2019.8731161

Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV. / Kino, Hisashi ; Fukushima, Takafumi ; Tanaka, Tetsu.

2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 222-224 8731161 (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kino, H , Fukushima, T & Tanaka, T 2019, Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV. in 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019., 8731161, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019, Institute of Electrical and Electronics Engineers Inc., pp. 222-224, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019, Singapore, Singapore, 19/3/12. https://doi.org/10.1109/EDTM.2019.8731161

Kino H , Fukushima T , Tanaka T. Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV. In 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 222-224. 8731161. (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019). https://doi.org/10.1109/EDTM.2019.8731161

Kino, Hisashi ; Fukushima, Takafumi ; Tanaka, Tetsu. / Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV. 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 222-224 (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019).

@inproceedings{a741960314b142f69eef3b203ee9a8da,

title = "Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV",

abstract = "The effect of noise propagation from a digital circuit on an analog circuit was evaluated using an actual mixed-signal 3D-IC, which has a stacked structure of digital and analog IC chips. The noise propagation through the TSV was measured with a ring-oscillator as a noise source. To investigate in detail, TSV-liner interface states were evaluated along depth direction using unique multi-well-structured TSVs and charge-pumping method. It was considered that the interface traps and non-conformal thickness of TSV liner increased the noise propagation among stacked chips.",

keywords = "3D-IC, Mixed signal, Noise, TSV",

author = "Hisashi Kino and Takafumi Fukushima and Tetsu Tanaka",

year = "2019",

month = mar,

doi = "10.1109/EDTM.2019.8731161",

language = "English",

series = "2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "222--224",

booktitle = "2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019",

note = "2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 ; Conference date: 12-03-2019 Through 15-03-2019",

}

TY - GEN

T1 - Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV

AU - Kino, Hisashi

AU - Fukushima, Takafumi

AU - Tanaka, Tetsu

PY - 2019/3

Y1 - 2019/3

N2 - The effect of noise propagation from a digital circuit on an analog circuit was evaluated using an actual mixed-signal 3D-IC, which has a stacked structure of digital and analog IC chips. The noise propagation through the TSV was measured with a ring-oscillator as a noise source. To investigate in detail, TSV-liner interface states were evaluated along depth direction using unique multi-well-structured TSVs and charge-pumping method. It was considered that the interface traps and non-conformal thickness of TSV liner increased the noise propagation among stacked chips.

AB - The effect of noise propagation from a digital circuit on an analog circuit was evaluated using an actual mixed-signal 3D-IC, which has a stacked structure of digital and analog IC chips. The noise propagation through the TSV was measured with a ring-oscillator as a noise source. To investigate in detail, TSV-liner interface states were evaluated along depth direction using unique multi-well-structured TSVs and charge-pumping method. It was considered that the interface traps and non-conformal thickness of TSV liner increased the noise propagation among stacked chips.

KW - 3D-IC

KW - Mixed signal

KW - Noise

KW - TSV

UR - http://www.scopus.com/inward/record.url?scp=85067814829&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85067814829&partnerID=8YFLogxK

U2 - 10.1109/EDTM.2019.8731161

DO - 10.1109/EDTM.2019.8731161

M3 - Conference contribution

AN - SCOPUS:85067814829

T3 - 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019

SP - 222

EP - 224

BT - 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019

Y2 - 12 March 2019 through 15 March 2019

ER -