Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The effect of noise propagation from a digital circuit on an analog circuit was evaluated using an actual mixed-signal 3D-IC, which has a stacked structure of digital and analog IC chips. The noise propagation through the TSV was measured with a ring-oscillator as a noise source. To investigate in detail, TSV-liner interface states were evaluated along depth direction using unique multi-well-structured TSVs and charge-pumping method. It was considered that the interface traps and non-conformal thickness of TSV liner increased the noise propagation among stacked chips.

Original languageEnglish
Title of host publication2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages222-224
Number of pages3
ISBN (Electronic)9781538665084
DOIs
Publication statusPublished - 2019 Mar
Event2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 - Singapore, Singapore
Duration: 2019 Mar 122019 Mar 15

Publication series

Name2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019

Conference

Conference2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
CountrySingapore
CitySingapore
Period19/3/1219/3/15

Keywords

  • 3D-IC
  • Mixed signal
  • Noise
  • TSV

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Hardware and Architecture

Fingerprint Dive into the research topics of 'Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV'. Together they form a unique fingerprint.

Cite this