Nickel-stabilized nanoporous copper fabricated from ternary TiCuNi amorphous alloys

Zhenhua Dan, Fengxiang Qin, Yu Sugawara, Izumi Muto, Akihiro Makino, Nobuyoshi Hara

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)

Abstract

Minor additive nickel (1 at%) to Ti-Cu amorphous alloy helped to form the finer nanoporous copper (NPC). The pore size of open-cell nanoporous fcc Cu was confirmed to be 71 nm for Ti60Cu40 alloy and 23 nm for Ti60Cu39Ni1 alloy after immersion of 43.2 ks in 0.03 M HF solution at 298 K. The pore size increased with immersion time in a form of the power law function with an exponent of 0.26. The estimated surface diffusivity decreased by about two orders of magnitude from 2.5×10 -18 to 2.7×10-20 m2 s-1by adding 1 at% Ni to Ti60Cu40 ribbons. The activation energy of surface diffusion of Cu atoms was estimated to be 68 kJ mol-1. The refinement of nanoporous Cu was resulted from the additive Ni with one-order lower surface diffusivity than Cu. Ni adatoms acted as a barrier for the diffusion and rearrangement of Cu adatoms, as a result, the smaller nanopores formed on Ti-Cu-Ni amorphous alloy.

Original languageEnglish
Pages (from-to)128-131
Number of pages4
JournalMaterials Letters
Volume94
DOIs
Publication statusPublished - 2013 Jan 18

Keywords

  • Amorphous materials
  • Diffusion
  • Porous materials

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Nickel-stabilized nanoporous copper fabricated from ternary TiCuNi amorphous alloys'. Together they form a unique fingerprint.

Cite this