Next-generation IGBT module structure for hybrid vehicle with high cooling performance and high temperature operation

Akira Morozumi, Hiromichi Gohara, Fumihiko Momose, Takashi Saito, Yoshitaka Nishimura, Eiji Mochizuki, Yoshikazu Takahashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We developed a new technology for the Fuji 4th generation power module for hybrid vehicle application. It achieved a 30-% volume reduction, and a 33-% weight reduction compared to the 3rd generation. Requirement trends for the power module for hybrid vehicles are high energy-efficient, downsizing, lightweight and higher reliability. To achieve these requirements, IGBT module needs low thermal resistance and high operating temperature. We developed new technologies, 1) New cooling structure with high cooling performance. 2) The Tjmax.=175°C continuous operation with automotive required quality.

Original languageEnglish
Title of host publication2014 International Power Electronics Conference, IPEC-Hiroshima - ECCE Asia 2014
PublisherIEEE Computer Society
Pages671-676
Number of pages6
ISBN (Print)9781479927050
DOIs
Publication statusPublished - 2014 Jan 1
Externally publishedYes
Event7th International Power Electronics Conference, IPEC-Hiroshima - ECCE Asia 2014 - Hiroshima, Japan
Duration: 2014 May 182014 May 21

Publication series

Name2014 International Power Electronics Conference, IPEC-Hiroshima - ECCE Asia 2014

Other

Other7th International Power Electronics Conference, IPEC-Hiroshima - ECCE Asia 2014
Country/TerritoryJapan
CityHiroshima
Period14/5/1814/5/21

Keywords

  • Direct Liquid Cooling
  • High Reliability
  • High Temperature Operation
  • Hybrid Vehicle
  • IGBT Module

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Next-generation IGBT module structure for hybrid vehicle with high cooling performance and high temperature operation'. Together they form a unique fingerprint.

Cite this