Next-gen IGBT module structure for hybrid vehicle with high cooling performance and high temperature operation

Hiromichi Gohara, Yoshitaka Nishimura, Akira Morozumi, Peter Dietrich, Eiji Mochi Zuki, Yoshikazu Takahashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Trends of the Power module for hybrid vehicle are high effective, downsizing, lightweight and higher reliability. To achieve these requirements, IGBT module needs low thermal resistance and high operating temperature. In this paper, we developed new technologies. One technology is the cooling structures which has a direct liquid cooling structure with a solder-joined aluminum heat sink. The module achieves a 30-% volume reduction and a 60-% weight reduction compared to our conventional models. A heat sink with high cooling capacity and a high-strength solder were newly developed to establish the structure. And other is the maximum junction temperature, Tjmax = 175°C continuous operation with automotive required quality. We have applied these new technologies to the next-gen IGBT module for hybrid vehicle application.

Original languageEnglish
Title of host publicationProceedings - PCIM Europe 2014
Subtitle of host publicationInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
PublisherMesago PCIM GmbH
Pages1187-1194
Number of pages8
ISBN (Print)9783800736034
Publication statusPublished - 2014 Jan 1
Externally publishedYes
EventInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2014 - Nuremberg, Germany
Duration: 2014 May 202014 May 22

Publication series

NamePCIM Europe Conference Proceedings
ISSN (Electronic)2191-3358

Other

OtherInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2014
Country/TerritoryGermany
CityNuremberg
Period14/5/2014/5/22

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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