We propose a new wafer stacking technology to integrate various kinds of devices into three-dimensional (3D) SoC. In 3D SoC, each circuit layer is stacked and electrically connected vertically using a huge number of buried interconnections and micro bumps. Hence we can dramatically increase the wiring connectivity and reduce the long wirings and integrate various kinds of devices with different fabrication process sequences into one chip. In this paper, we fabricated a 3D microprocessor consisting of three circuit layers and demonstrated the basic operation of the 3D microporcessor.
ASJC Scopus subject areas
- Chemical Engineering(all)