New ultrahigh-frequency plasma discharge for overcoming the limitations of etching processes

Engineering & Materials Science

• Etching 93%
• Electron temperature 90%
• Plasmas 80%
• Plasma sources 56%
• Helicons 32%
• Plasma waves 32%
• Ions 32%
• Langmuir probes 31%
• Electron cyclotron resonance 31%
• Temperature 20%
• Polysilicon 20%
• Fluorescence 20%
• Anisotropy 18%
• Lasers 13%
• Gases 9%

Physics & Astronomy

• plasma jets 81%
• etching 65%
• electron energy 28%
• ion temperature 27%
• electrostatic probes 13%
• plasma waves 13%
• electron cyclotron resonance 13%
• notches 13%
• laser induced fluorescence 12%
• selectivity 11%
• dissociation 10%
• anisotropy 7%
• causes 7%
• temperature 7%
• gases 6%

Chemical Compounds

• Electron Temperature 50%
• Ion Temperature 34%
• Electron Cyclotron Resonance 17%
• Laser Induced Fluorescence Spectroscopy 12%
• Anisotropy 10%
• Wave 10%
• Probe 6%
• Gas 5%