New three-dimensional wafer bonding technology using the adhesive injection method

Takuji Matsumoto, Masakazu Satoh, Katsuyuki Sakuma, Hiroyuki Kurino, Nobuaki Miyakawa, Hikotaro Itani, Mitsumasa Koyanagi

Research output: Contribution to journalArticle

71 Citations (Scopus)

Abstract

A new three-dimensional (3D) wafer bonding technology using the adhesive injection method has been proposed, in order to realize a real-time micro-vision system and a real shared memory. Several key technologies for 3D LSI, such as deep trench formation for buried interconnection, wafer grinding and chemical-mechanical polishing, wafer alignment and wafer bonding using the adhesive injection method, have been developed.

Original languageEnglish
Pages (from-to)1217-1221
Number of pages5
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume37
Issue number3 SUPPL. B
DOIs
Publication statusPublished - 1998 Mar

Keywords

  • 3D wafer bonding technology
  • Adhesive injection method
  • Buried interconnection
  • Chemical-mechanical polishing
  • Wafer alignment

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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