New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique

Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journalConference articlepeer-review

89 Citations (Scopus)

Abstract

We have proposed a new three-dimensional (3D) integration technology based on reconfigured wafer-on-wafer bonding technique to solve several problems in 3D integration technology using the conventional wafer-on-wafer bonding technique. 3D LSIs are fabricated by bonding the reconfigured wafers onto the supporting Si wafer. The reconfigured wafer consists of many known good dies (KGDs) which are arrayed and glued on a holding Si wafer with Si steps by chip self-assembly technique. Therefore, the yield of the reconfigured wafer can be 100 %. As a result, we can obtain a high production yield even after bonding many wafers. In addition, it is not necessary in the reconfigured wafer that the chip size has to be identical within the wafer. Therefore, we can stack various kinds of chips with different chip sizes, different materials and different devices in our new 3D integration technology based on the configured-wafer-on-wafer bonding technique (Reconfig. W-on-W 3D technology). We have developed key technologies to form W Through-Si-Via (TSV) in the reconfigured wafer to fabricated 3D LSI test chips. We obtained excellent electrical characteristics of W-TSV using the daisy chain in 3D LSI test chip.

Original languageEnglish
Article number4419119
Pages (from-to)985-988
Number of pages4
JournalTechnical Digest - International Electron Devices Meeting, IEDM
DOIs
Publication statusPublished - 2007 Dec 1
Event2007 IEEE International Electron Devices Meeting, IEDM - Washington, DC, United States
Duration: 2007 Dec 102007 Dec 12

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Fingerprint

Dive into the research topics of 'New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique'. Together they form a unique fingerprint.

Cite this