New spin cleaner with megasonic for single wafer processing based on UCT cleaning concept

Shouichi Okano, Kazuhiko Kawada, Mitsunori Nakamori, Takahisa Nitta, Tadahiro Ohmi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In compliance with pattern density increase of Si substrates, Ultra clean of more large surface of materials are required, and single wafer processing are catching manufacturer's attention. For this cleaning equipment, new type spin cleaner by using high frequency ultrasonic cleaner unit (we call Megasonic squall), is developed which generates solvent flow curtain having 1.6 MHz ultrasonic energy. Process of development, structure and cleaning technical characters will be described.

Original languageEnglish
Title of host publicationIEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings
Editors Anon
PublisherIEEE
Publication statusPublished - 1997
EventProceedings of the 1997 IEEE International Symposium on Semiconductor on Manufacturing Conference - San Francisco, CA, USA
Duration: 1997 Oct 61997 Oct 8

Other

OtherProceedings of the 1997 IEEE International Symposium on Semiconductor on Manufacturing Conference
CitySan Francisco, CA, USA
Period97/10/697/10/8

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

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