Abstract
In compliance with pattern density increase of Si substrates, Ultra clean of more large surface of materials are required, and single wafer processing are catching manufacturer's attention. For this cleaning equipment, new type spin cleaner by using high frequency ultrasonic cleaner unit (we call Megasonic squall), is developed which generates solvent flow curtain having 1.6 MHz ultrasonic energy. Process of development, structure and cleaning technical characters will be described.
| Original language | English |
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| Title of host publication | IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings |
| Editors | Anon |
| Publisher | IEEE |
| Publication status | Published - 1997 |
| Event | Proceedings of the 1997 IEEE International Symposium on Semiconductor on Manufacturing Conference - San Francisco, CA, USA Duration: 1997 Oct 6 → 1997 Oct 8 |
Other
| Other | Proceedings of the 1997 IEEE International Symposium on Semiconductor on Manufacturing Conference |
|---|---|
| City | San Francisco, CA, USA |
| Period | 97/10/6 → 97/10/8 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Industrial and Manufacturing Engineering