New ram-bus memory system with interchip optical interconnection

Kouji Miyake, Tsuyoshi Tanaka, Takeshi Etoh, Morikazu Tsuno, Shin Yokoyama, Mitsumasa Koyanagi

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

A new optical RAM-bus (ORAM-bus) memory system has been proposed. The ORAM-bus memory has a number of optical interconnections to connect many memory chips. Data transfer using the guided optical interconnections is performed through the optical coupling flip-flop (OC-FF) circuit of the optical coupling sense amplifiers. The ORAM-bus memory test chips were fabricated using 2 μm complementary metal-oxide-semiconductor (CMOS) technology. The light-emitting diodes (LEDs) were successfully bonded onto the silicon test chips using the newly developed microbonding technology. The optical writing operation for ORAM-bus memory was demonstrated using the test chip.

Original languageEnglish
Pages (from-to)848-851
Number of pages4
JournalJapanese journal of applied physics
Volume33
Issue number1
DOIs
Publication statusPublished - 1994 Jan 1

Keywords

  • LED
  • Microbonding
  • ORAM-bus memory
  • Optical interconnection
  • Optical writing
  • Photodetector

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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