A new numerical method, the so-called MMD method, for electromagnetomechanical coupling analysis was proposed and applied to a thin plate dynamic behavior analysis for its verification test. It becomes important to evaluate the dynamic behavior of electrically conducting structure under strong magnetic field. The coupling effect between eddy current and deformation of structure plays an important role in the dynamic behavior in the field. The method developed here considering the coupling effect is based on a modal analysis method and FEM. Magnetic viscous damping coefficient for each natural vibrational mode can be obtained. Using this coefficient eddy current and plate bending can be calculated separately but considering the coupling effect. Numerical results of the verification test show good agreement between the proposed method and the conventional one.
|Number of pages||8|
|Journal||International journal of applied electromagnetics in materials|
|Publication status||Published - 1993 Jun 1|
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