New mechanical reliability issues for deep-submicron devices

Hideo Miura, Shuji Ikeda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this paper, we discuss new reliability issues for manufacturing deep-submicron semiconductor devices; mechanical reliability issues which cause serious damages in semiconductor devices. Typical damages are dislocations in silicon substrates, delamination or cracking of thin films, and deterioration of electronic characteristics of devices. Mechanical stress develops in device structures due to not only mismatches in thermal expansion coefficients among thin film materials but also intrinsic stress of thin films such as poly-silicon and silicides. Fine patterning by dry etching makes sharp edges which also cause high stress due to stress concentration. The main manufacturing processes at which stress mainly develops are isolation, gate formation, and interconnect formation. We review each process for highly reliable manufacturing. Finally we mention the effect of residual stress in transistor areas on the shift in the electronic characteristic of MOS transistors.

Original languageEnglish
Title of host publication1998 Semiconductor Manufacturing Technology Workshop, SMTW 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages140-147
Number of pages8
ISBN (Print)0780351797, 9780780351790
DOIs
Publication statusPublished - 1998 Jan 1
Externally publishedYes
Event1998 Semiconductor Manufacturing Technology Workshop, SMTW 1998 - Hsinchu, Taiwan, Province of China
Duration: 1998 Jun 16 → …

Publication series

Name1998 Semiconductor Manufacturing Technology Workshop, SMTW 1998

Other

Other1998 Semiconductor Manufacturing Technology Workshop, SMTW 1998
CountryTaiwan, Province of China
CityHsinchu
Period98/6/16 → …

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering
  • Hardware and Architecture

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