New measurement concept of nanometer-level defects on Si wafer surface by using micro contact sensor

Wenjian Lu, Shimizu Yuki, Gao Wei

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

A thermal-type contact sensor was proposed to detect small defects, the heights of which are less than 16 nm, on the wafer surface. The feasibility of the contact sensor, which detects frictional heat generated at the contact, was theoretically investigated focusing on the temperature rise of the sensor element. Simulation results with both the simple model of heat transfer and the FEM model showed that the expected temperature rise of the contact sensor is enough to be detected by the conventional electric circuit.

Original languageEnglish
Title of host publicationUltra-Precision Machining Technologies
Pages137-141
Number of pages5
DOIs
Publication statusPublished - 2012 Apr 30
Externally publishedYes
Event8th CHINA-JAPAN International Conference on Ultra-Precision Machining, CJUPM 2011 - Hangzhou City, China
Duration: 2011 Nov 202011 Nov 22

Publication series

NameAdvanced Materials Research
Volume497
ISSN (Print)1022-6680

Other

Other8th CHINA-JAPAN International Conference on Ultra-Precision Machining, CJUPM 2011
CountryChina
CityHangzhou City
Period11/11/2011/11/22

Keywords

  • Contact sensor
  • Frictional heat
  • Heat transfer
  • Wafer inspection

ASJC Scopus subject areas

  • Engineering(all)

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