New insulation material with flat-surface, low coefficient of thermal expansion, low-dielectric-loss for next generation semiconductor packages

M. Sugimura, H. Imai, M. Kawasaki, K. Kamata, K. Fujii, Y. Fujito, S. Yonehara, Akinobu Teramoto, Shigetoshi Sugawa, T. Ohmi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

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