New insulation material with flat-surface, low coefficient of thermal expansion, low-dielectric-loss for next generation semiconductor packages

M. Sugimura, H. Imai, M. Kawasaki, K. Kamata, K. Fujii, Y. Fujito, S. Yonehara, Akinobu Teramoto, Shigetoshi Sugawa, T. Ohmi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

From recent technological backgrounds, packaging materials for semiconductor applications play a significant role in increased number of pins for grid array, miniaturization, high transmission performance and high reliability. In order to achieve such requirement, we have developed an insulation material for build-up layer package with four outstanding properties; high adhesivity between Cu line and substrate with flat surface, extremely low water absorption, low expansion coefficient, and low dielectric constant with low dielectric loss. We made a technological breakmrough for the Cu line formation onto a quite smooth substrate surface, showing that 10μm/10μm pattern in line and space can be formed finely by using a semi-additive method. Insulation reliability tests for the developed material were studied. The developed material show significantly better reliability than that of existing epoxy based material. We also studied high frequency signal propagation properties of the developed material. The developed material realizes substantial reduction of high frequency propagation loss from existing material. We concluded those technological development can contribute to the semiconductor packaging technology trend toward high density, high speed with high reliability.

Original languageEnglish
Title of host publication2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages747-752
Number of pages6
DOIs
Publication statusPublished - 2008 Sep 15
Event2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: 2008 May 272008 May 30

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2008 58th Electronic Components and Technology Conference, ECTC
CountryUnited States
CityLake Buena Vista, FL
Period08/5/2708/5/30

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'New insulation material with flat-surface, low coefficient of thermal expansion, low-dielectric-loss for next generation semiconductor packages'. Together they form a unique fingerprint.

  • Cite this

    Sugimura, M., Imai, H., Kawasaki, M., Kamata, K., Fujii, K., Fujito, Y., Yonehara, S., Teramoto, A., Sugawa, S., & Ohmi, T. (2008). New insulation material with flat-surface, low coefficient of thermal expansion, low-dielectric-loss for next generation semiconductor packages. In 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC (pp. 747-752). [4550057] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2008.4550057