New heterogeneous multi-chip module integration technology using self-assembly method

T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. C. Jeong, Y. Ohara, A. Noriki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. K. Yin, K. Inamura, K. W. Lee, J. C. Bea, T. Tanaka, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

41 Citations (Scopus)

Abstract

We have newly proposed heterogeneous multi-chip module integration technologies in which MEMS and LSI chips are mounted on Si or flexible substrates using a self-assembly method. A large numbers of chips were precisely and simultaneously self-assembled and bonded onto the substrates with high alignment accuracy of approximately 400 nm. Thick MEMS and LSI chips with a thickness of more than 100 μm were electrically connected by unique lateral interconnections formed crossing over chip edges with large step height. We evaluated fundamental electrical characteristics using daisy chains formed crossing over test chips which were face-up bonded onto the substrates by the self-assembly. We obtained excellent characteristics in these daisy chains. In addition, RF test chips with amplitude shift keying (ASK) demodulator and signal processing circuits were self-assembled onto the substrates and electrically connected by the lateral interconnections. We confirmed that these test chips work well.

Original languageEnglish
Title of host publication2008 IEEE International Electron Devices Meeting, IEDM 2008
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 IEEE International Electron Devices Meeting, IEDM 2008 - San Francisco, CA, United States
Duration: 2008 Dec 152008 Dec 17

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Other

Other2008 IEEE International Electron Devices Meeting, IEDM 2008
CountryUnited States
CitySan Francisco, CA
Period08/12/1508/12/17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Fingerprint Dive into the research topics of 'New heterogeneous multi-chip module integration technology using self-assembly method'. Together they form a unique fingerprint.

Cite this