New fabrication process elements of phase-mode logic circuits

Takeshi Onomi; Koji Nakajima

doi:10.1109/77.783739

New fabrication process elements of phase-mode logic circuits

Takeshi Onomi, Koji Nakajima

Research Institute of Electrical Communication (RIEC)

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

We present the phase-mode circuits based on new fabrication process elements for highdensity circuit integration. Nb/AlN_x/Nb overdamped junctions without external resistive shunts are applied to the phase-mode circuits. The area of a bias feed resistor can be reduced by a replacement of the metallic resistor by the junction normal resistance. As a miniaturization method of an inductance, the effective inductance of a Josephson junction is used. The phase-mode circuits based on these new integration methods have been fabricated by Nb integration technology. Various aspects which are brought about by these fabrication technologies are discussed.

Original language	English
Pages (from-to)	3318-3321
Number of pages	4
Journal	IEEE Transactions on Applied Superconductivity
Volume	9
Issue number	2 PART 3
DOIs	https://doi.org/10.1109/77.783739
Publication status	Published - 1999 Dec 1

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering

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@article{bd210dd539ab4c4c87b360abec797d0f,

title = "New fabrication process elements of phase-mode logic circuits",

abstract = "We present the phase-mode circuits based on new fabrication process elements for highdensity circuit integration. Nb/AlNx/Nb overdamped junctions without external resistive shunts are applied to the phase-mode circuits. The area of a bias feed resistor can be reduced by a replacement of the metallic resistor by the junction normal resistance. As a miniaturization method of an inductance, the effective inductance of a Josephson junction is used. The phase-mode circuits based on these new integration methods have been fabricated by Nb integration technology. Various aspects which are brought about by these fabrication technologies are discussed.",

author = "Takeshi Onomi and Koji Nakajima",

year = "1999",

month = dec,

day = "1",

doi = "10.1109/77.783739",

language = "English",

volume = "9",

pages = "3318--3321",

journal = "IEEE Transactions on Applied Superconductivity",

issn = "1051-8223",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "2 PART 3",

}

TY - JOUR

T1 - New fabrication process elements of phase-mode logic circuits

AU - Onomi, Takeshi

AU - Nakajima, Koji

PY - 1999/12/1

Y1 - 1999/12/1

N2 - We present the phase-mode circuits based on new fabrication process elements for highdensity circuit integration. Nb/AlNx/Nb overdamped junctions without external resistive shunts are applied to the phase-mode circuits. The area of a bias feed resistor can be reduced by a replacement of the metallic resistor by the junction normal resistance. As a miniaturization method of an inductance, the effective inductance of a Josephson junction is used. The phase-mode circuits based on these new integration methods have been fabricated by Nb integration technology. Various aspects which are brought about by these fabrication technologies are discussed.

AB - We present the phase-mode circuits based on new fabrication process elements for highdensity circuit integration. Nb/AlNx/Nb overdamped junctions without external resistive shunts are applied to the phase-mode circuits. The area of a bias feed resistor can be reduced by a replacement of the metallic resistor by the junction normal resistance. As a miniaturization method of an inductance, the effective inductance of a Josephson junction is used. The phase-mode circuits based on these new integration methods have been fabricated by Nb integration technology. Various aspects which are brought about by these fabrication technologies are discussed.

UR - http://www.scopus.com/inward/record.url?scp=0032682799&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032682799&partnerID=8YFLogxK

U2 - 10.1109/77.783739

DO - 10.1109/77.783739

M3 - Article

AN - SCOPUS:0032682799

VL - 9

SP - 3318

EP - 3321

JO - IEEE Transactions on Applied Superconductivity

JF - IEEE Transactions on Applied Superconductivity

SN - 1051-8223

IS - 2 PART 3

ER -