New era of silicon technologies due to radical reaction based semiconductor manufacturing

Tadahiro Ohmi, Masaki Hirayama, Akinobu Teramoto

Research output: Contribution to journalArticlepeer-review

94 Citations (Scopus)

Abstract

Current semiconductor technology, the so-called the molecule reaction based semiconductor manufacturing, now faces a very severe standstill due to the drastic increase of gate leakage currents and drain leakage currents. Radical reaction based semiconductor manufacturing has been developed to completely overcome the current standstill by introducing microwave excited high density plasma with very low electron temperatures and without accompanying charge-up damage. The introduction of radical reaction based semiconductor manufacturing has made it possible to fabricate LSI devices on any crystal orientation Si substrate surface as well as (100) Si substrate surfaces, and to eliminate a very severe limitation to the antenna ratio in the circuit layout patterns, which is strictly limited to less than 100-200 in order to obtain a relatively high production yield.

Original languageEnglish
Pages (from-to)R1-R17
JournalJournal of Physics D: Applied Physics
Volume39
Issue number1
DOIs
Publication statusPublished - 2006 Jan 7

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Acoustics and Ultrasonics
  • Surfaces, Coatings and Films

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