New creep region in pure face-centered cubic metals at low temperatures

Tetsuya Matsunaga, Shouji Ueda, Eiichi Sato

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)


Creep behavior was investigated carefully for typical face-centered cubic (fcc) metals, i.e., high purity Al, Cu, and Pb, below 0.3Tm, where Tm is the melting temperature. All samples showed marked creep behavior at such low temperatures, with an apparent activation energy of 15-30 kJ mol-1, a stress exponent of 2-5 and a grain size exponent of 0. These results show a new creep region that has not appeared in deformation mechanism maps of pure fcc metals.

Original languageEnglish
Pages (from-to)516-519
Number of pages4
JournalScripta Materialia
Issue number5
Publication statusPublished - 2010 Sep 1


  • Aluminum
  • Copper
  • Deformation mechanism map
  • Lead

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys


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