New concept of TSV formation methodology using Directed Self-Assembly (DSA)

Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A new TSV formation methodology based on advanced Directed Self-Assembly (DSA) with nanocomposites consisting of nano metal particles and block-co-polymers is proposed in this paper. Cylindrical nano-ordered structures are formed in Si deep holes through phase separation of polystyrene-block-poly methyl methacrylate polymers (PS-b-PMMA). The impact of molecular weight of the polymers, composition (PS/PMMA ratio), and phase separation temperature on the morphologies is discussed. In addition, simulation results using Self-Consistent Field (SCF) theory are introduced to make fine-pitch TSV.

Original languageEnglish
Title of host publication2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509013999
DOIs
Publication statusPublished - 2017 Jul 5
Event2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 - San Francisco, United States
Duration: 2016 Nov 82016 Nov 11

Publication series

Name2016 IEEE International 3D Systems Integration Conference, 3DIC 2016

Other

Other2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
Country/TerritoryUnited States
CitySan Francisco
Period16/11/816/11/11

Keywords

  • 3D Integration Technology
  • Directed Self-Assembly (DSA)
  • Nano metal particles
  • Self-Consistent Field (SCF) theory
  • Through-Silicon Via (TSV)

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electronic, Optical and Magnetic Materials
  • Computer Networks and Communications

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