New chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding

T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

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Physics & Astronomy

Chemical Compounds

Engineering & Materials Science