New assembly technologies for Tjmax=175°C continuous operation guaranty of IGBT module

T. Saito, Y. Nishimura, K. Kido, F. Momose, E. Mochizuki, Y. Takahashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Citations (Scopus)

Abstract

In this paper, in order to realize the next generation IGBT module, the failure mechanisms of PC (power cycling) test at high operation temperature of Tjmax (maximum junction temperature) =175°C is investigated. From these detailed investigations, we have cleared that these failure modes are dominated by three major physical and mechanical phenomena under the categorized three temperature regions. By using these results, we have developed three new technologies for achieving higher PC capability: (a) New Al (Aluminium) wire with higher fatigue capability, (b) High strength solder at high temperature, (c) New die metallization with higher strength under high temperature and low thermal stress between Si (Silicon) die and Al wire. With these technologies, our new IGBT module has the excellent PC capability of continuous operation at Tjmax=175°C and longer lifetime compared with the conventional one.

Original languageEnglish
Title of host publicationProceedings - PCIM Europe 2013
Subtitle of host publicationInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
PublisherMesago PCIM GmbH
Pages455-461
Number of pages7
ISBN (Print)9783800735051
Publication statusPublished - 2013 Jan 1
Externally publishedYes
EventInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2013 - Nuremberg, Germany
Duration: 2013 May 142013 May 16

Publication series

NamePCIM Europe Conference Proceedings
ISSN (Electronic)2191-3358

Other

OtherInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2013
CountryGermany
CityNuremberg
Period13/5/1413/5/16

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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