A neuromorphic vision chip with three dimesional structure was fabricated using three dimensional integration technology. The device wafer with buried interconnections was glued to the quartz glass and then thinned from the backside using mechanical grinding and chemical mechanical polishing (CMP). On the bottom of the buried interconnections on the backside, micro bumps were formed. The thinned wafer was glued to another wafer. The three dimensional stacked wafer was obtained by repeating this sequence.
|Journal||Digest of Technical Papers - IEEE International Solid-State Circuits Conference|
|Publication status||Published - 2001 Jan 1|
|Event||Digest of Technical Papers - IEEE International Solid-State Circuits Conference - |
Duration: 2001 Feb 5 → 2001 Feb 6
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering