NEMS/MEMS and passive components integration by using novel LTCC substrate

Joerg Eckhardt Froemel, Yu Ching Lin, Mamoru Mori, Shuji Tanaka, Thomas Gessner, Masayoshi Esashi

Research output: Contribution to conferencePaper

Abstract

A concept for a one chip tunable RF device has been presented. This concept uses a novel LTCC substrate with unique features that allow integration of passive electric components as well as MEMS and microelectronic devices. Key functionality of these LTCC is the to silicon matched thermal expansion coefficient and the ability for anodic bonding. New nanomaterial based passive devices are being used to reach a very high grade of miniaturization.

Original languageEnglish
Publication statusPublished - 2010 Jan 1
EventSystems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components - Como, Italy
Duration: 2010 Mar 232010 Mar 24

Other

OtherSystems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components
CountryItaly
CityComo
Period10/3/2310/3/24

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'NEMS/MEMS and passive components integration by using novel LTCC substrate'. Together they form a unique fingerprint.

  • Cite this

    Froemel, J. E., Lin, Y. C., Mori, M., Tanaka, S., Gessner, T., & Esashi, M. (2010). NEMS/MEMS and passive components integration by using novel LTCC substrate. Paper presented at Systems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components, Como, Italy.