A concept for a one chip tunable RF device has been presented. This concept uses a novel LTCC substrate with unique features that allow integration of passive electric components as well as MEMS and microelectronic devices. Key functionality of these LTCC is the to silicon matched thermal expansion coefficient and the ability for anodic bonding. New nanomaterial based passive devices are being used to reach a very high grade of miniaturization.
|Publication status||Published - 2010 Jan 1|
|Event||Systems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components - Como, Italy|
Duration: 2010 Mar 23 → 2010 Mar 24
|Other||Systems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components|
|Period||10/3/23 → 10/3/24|
ASJC Scopus subject areas
- Electrical and Electronic Engineering