NDI of delamination in IC packages using millimeter-wave

Yang Ju, Masumi Saka, Hiroyuki Abe

Research output: Contribution to conferencePaperpeer-review

2 Citations (Scopus)

Abstract

A nondestructive inspection system using millimeter-wave was developed for detection of delamination in IC packages. An open-ended coaxial line sensor was used as a source and also a receiver of millimeter-wave signal that was transmitted into and reflected from the packages. The phase of the reflection coefficient was measured for obtaining the information of the delamination. The package was scanned in two perpendicular directions on a plane parallel to the package. A two-dimensional image was created by using the raw data of the millimeter-wave measurement. The millimeter-wave image showed almost same feature as that of scanning acoustic tomography. The delamination was detected significantly without coupling medium. Also scanning the package in one direction along the centerline of the package showed a higher sensitivity for distinguishing the delamination, thereby showing a potential for the on line detection of delamination in IC packages. The millimeter-wave inspection system was proved to be a powerful tool for the integrity assessment of IC packages.

Original languageEnglish
Pages1597-1602
Number of pages6
Publication statusPublished - 2000 Jan 1
EventIMTC/2000 - 17th IEEE Instrumentation and Measurement Technology Conference 'Smart Connectivity: Integrating Measurement and Control' - Baltimore, MD, USA
Duration: 2000 May 12000 May 4

Other

OtherIMTC/2000 - 17th IEEE Instrumentation and Measurement Technology Conference 'Smart Connectivity: Integrating Measurement and Control'
CityBaltimore, MD, USA
Period00/5/100/5/4

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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