Narrow stripe fabrication of soft magnetic materials by trench filling process

H. Yoda, A. Hori, N. Inoue, Masashi Sahashi, A. Sawabe

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Low-pressure collimation sputtering was applied to trench filling with soft magnetic materials. Collimation and substrate bias were found effective to fill the trenches with a uniform film. NiFe and CoZrNb were tested as soft magnetic materials, and it was found that NiFe was suitable for the process. Stripes of NiFe about two micron wide and one micron high, and with excellent morphology, were fabricated inside trenches by combining collimation sputtering with an etch-back process.

Original languageEnglish
Pages (from-to)2666-2668
Number of pages3
JournalIEEE Transactions on Magnetics
Volume31
Issue number6
DOIs
Publication statusPublished - 1995 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Narrow stripe fabrication of soft magnetic materials by trench filling process'. Together they form a unique fingerprint.

Cite this