Nanostructured silicon carbide molds for glass press molding

Jihyun Shin; Shuji Tanaka; Masayoshi Esashi

doi:10.1109/NEMS.2007.352019

Nanostructured silicon carbide molds for glass press molding

Jihyun Shin, Shuji Tanaka, Masayoshi Esashi

ENG - Robotics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Citations (Scopus)

Abstract

This paper reports the first result of press molding of Pyrex glass using a silicon carbide (SiC) mold with nanopatterns. First, the nanopatterns were formed on a silicon substrate by electron beam lithography and fast atom beam (FAB) etching. To transfer these patterns to SiC, SiC was deposited on the patterned silicon substrate, and the SiC surface was polished to mirror finish. Subsequently, a SiC ceramic plate was bonded to the polished SiC surface using sputter deposited nickel as an interlayer. Finally, the silicon substrate was etched to release the SiC mold. Using the fabricated SiC molds without an anti-sticking layer, we succeeded in press-molding Pyrex glass (Corning 7740) at 800°C. In this process, we found surface roughening problem, which occurs in SiC atmospheric vapor deposition on FAB-etched areas. This is due to damage in silicon by FAB, and enhanced under the existence of surface natural oxide.

Original language	English
Title of host publication	Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
Pages	250-253
Number of pages	4
DOIs	https://doi.org/10.1109/NEMS.2007.352019
Publication status	Published - 2007
Event	2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 - Bangkok, Thailand Duration: 2007 Jan 16 → 2007 Jan 19

Publication series

Name	Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007

Other

Other	2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
Country/Territory	Thailand
City	Bangkok
Period	07/1/16 → 07/1/19

Keywords

APCVD
Glass
Press molding
Silicon carbide

ASJC Scopus subject areas

Computer Networks and Communications
Computer Science Applications
Electrical and Electronic Engineering

Access to Document

10.1109/NEMS.2007.352019

Cite this

Shin, J., Tanaka, S., & Esashi, M. (2007). Nanostructured silicon carbide molds for glass press molding. In Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 (pp. 250-253). [4160577] (Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007). https://doi.org/10.1109/NEMS.2007.352019

Nanostructured silicon carbide molds for glass press molding. / Shin, Jihyun; Tanaka, Shuji; Esashi, Masayoshi.

Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007. 2007. p. 250-253 4160577 (Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shin, J, Tanaka, S & Esashi, M 2007, Nanostructured silicon carbide molds for glass press molding. in Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007., 4160577, Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007, pp. 250-253, 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007, Bangkok, Thailand, 07/1/16. https://doi.org/10.1109/NEMS.2007.352019

Shin J, Tanaka S, Esashi M. Nanostructured silicon carbide molds for glass press molding. In Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007. 2007. p. 250-253. 4160577. (Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007). doi: 10.1109/NEMS.2007.352019

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title = "Nanostructured silicon carbide molds for glass press molding",

abstract = "This paper reports the first result of press molding of Pyrex glass using a silicon carbide (SiC) mold with nanopatterns. First, the nanopatterns were formed on a silicon substrate by electron beam lithography and fast atom beam (FAB) etching. To transfer these patterns to SiC, SiC was deposited on the patterned silicon substrate, and the SiC surface was polished to mirror finish. Subsequently, a SiC ceramic plate was bonded to the polished SiC surface using sputter deposited nickel as an interlayer. Finally, the silicon substrate was etched to release the SiC mold. Using the fabricated SiC molds without an anti-sticking layer, we succeeded in press-molding Pyrex glass (Corning 7740) at 800°C. In this process, we found surface roughening problem, which occurs in SiC atmospheric vapor deposition on FAB-etched areas. This is due to damage in silicon by FAB, and enhanced under the existence of surface natural oxide.",

keywords = "APCVD, Glass, Press molding, Silicon carbide",

author = "Jihyun Shin and Shuji Tanaka and Masayoshi Esashi",

year = "2007",

doi = "10.1109/NEMS.2007.352019",

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AU - Shin, Jihyun

AU - Tanaka, Shuji

AU - Esashi, Masayoshi

PY - 2007

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N2 - This paper reports the first result of press molding of Pyrex glass using a silicon carbide (SiC) mold with nanopatterns. First, the nanopatterns were formed on a silicon substrate by electron beam lithography and fast atom beam (FAB) etching. To transfer these patterns to SiC, SiC was deposited on the patterned silicon substrate, and the SiC surface was polished to mirror finish. Subsequently, a SiC ceramic plate was bonded to the polished SiC surface using sputter deposited nickel as an interlayer. Finally, the silicon substrate was etched to release the SiC mold. Using the fabricated SiC molds without an anti-sticking layer, we succeeded in press-molding Pyrex glass (Corning 7740) at 800°C. In this process, we found surface roughening problem, which occurs in SiC atmospheric vapor deposition on FAB-etched areas. This is due to damage in silicon by FAB, and enhanced under the existence of surface natural oxide.

AB - This paper reports the first result of press molding of Pyrex glass using a silicon carbide (SiC) mold with nanopatterns. First, the nanopatterns were formed on a silicon substrate by electron beam lithography and fast atom beam (FAB) etching. To transfer these patterns to SiC, SiC was deposited on the patterned silicon substrate, and the SiC surface was polished to mirror finish. Subsequently, a SiC ceramic plate was bonded to the polished SiC surface using sputter deposited nickel as an interlayer. Finally, the silicon substrate was etched to release the SiC mold. Using the fabricated SiC molds without an anti-sticking layer, we succeeded in press-molding Pyrex glass (Corning 7740) at 800°C. In this process, we found surface roughening problem, which occurs in SiC atmospheric vapor deposition on FAB-etched areas. This is due to damage in silicon by FAB, and enhanced under the existence of surface natural oxide.

KW - APCVD

KW - Glass

KW - Press molding

KW - Silicon carbide

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ER -

Nanostructured silicon carbide molds for glass press molding

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