Nanostructured silicon carbide molds for glass press molding

Jihyun Shin, Shuji Tanaka, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper reports the first result of press molding of Pyrex glass using a silicon carbide (SiC) mold with nanopatterns. First, the nanopatterns were formed on a silicon substrate by electron beam lithography and fast atom beam (FAB) etching. To transfer these patterns to SiC, SiC was deposited on the patterned silicon substrate, and the SiC surface was polished to mirror finish. Subsequently, a SiC ceramic plate was bonded to the polished SiC surface using sputter deposited nickel as an interlayer. Finally, the silicon substrate was etched to release the SiC mold. Using the fabricated SiC molds without an anti-sticking layer, we succeeded in press-molding Pyrex glass (Corning 7740) at 800°C. In this process, we found surface roughening problem, which occurs in SiC atmospheric vapor deposition on FAB-etched areas. This is due to damage in silicon by FAB, and enhanced under the existence of surface natural oxide.

Original languageEnglish
Title of host publicationProceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
Pages250-253
Number of pages4
DOIs
Publication statusPublished - 2007 Aug 28
Event2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 - Bangkok, Thailand
Duration: 2007 Jan 162007 Jan 19

Publication series

NameProceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007

Other

Other2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
CountryThailand
CityBangkok
Period07/1/1607/1/19

Keywords

  • APCVD
  • Glass
  • Press molding
  • Silicon carbide

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Electrical and Electronic Engineering

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