TY - GEN
T1 - Nanostructured silicon carbide molds for glass press molding
AU - Shin, Jihyun
AU - Tanaka, Shuji
AU - Esashi, Masayoshi
PY - 2007/8/28
Y1 - 2007/8/28
N2 - This paper reports the first result of press molding of Pyrex glass using a silicon carbide (SiC) mold with nanopatterns. First, the nanopatterns were formed on a silicon substrate by electron beam lithography and fast atom beam (FAB) etching. To transfer these patterns to SiC, SiC was deposited on the patterned silicon substrate, and the SiC surface was polished to mirror finish. Subsequently, a SiC ceramic plate was bonded to the polished SiC surface using sputter deposited nickel as an interlayer. Finally, the silicon substrate was etched to release the SiC mold. Using the fabricated SiC molds without an anti-sticking layer, we succeeded in press-molding Pyrex glass (Corning 7740) at 800°C. In this process, we found surface roughening problem, which occurs in SiC atmospheric vapor deposition on FAB-etched areas. This is due to damage in silicon by FAB, and enhanced under the existence of surface natural oxide.
AB - This paper reports the first result of press molding of Pyrex glass using a silicon carbide (SiC) mold with nanopatterns. First, the nanopatterns were formed on a silicon substrate by electron beam lithography and fast atom beam (FAB) etching. To transfer these patterns to SiC, SiC was deposited on the patterned silicon substrate, and the SiC surface was polished to mirror finish. Subsequently, a SiC ceramic plate was bonded to the polished SiC surface using sputter deposited nickel as an interlayer. Finally, the silicon substrate was etched to release the SiC mold. Using the fabricated SiC molds without an anti-sticking layer, we succeeded in press-molding Pyrex glass (Corning 7740) at 800°C. In this process, we found surface roughening problem, which occurs in SiC atmospheric vapor deposition on FAB-etched areas. This is due to damage in silicon by FAB, and enhanced under the existence of surface natural oxide.
KW - APCVD
KW - Glass
KW - Press molding
KW - Silicon carbide
UR - http://www.scopus.com/inward/record.url?scp=34548132804&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34548132804&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2007.352019
DO - 10.1109/NEMS.2007.352019
M3 - Conference contribution
AN - SCOPUS:34548132804
SN - 1424406102
SN - 9781424406104
T3 - Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
SP - 250
EP - 253
BT - Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
T2 - 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
Y2 - 16 January 2007 through 19 January 2007
ER -