Nanostructure of wetting triple line in a Ag - Cu - Ti/Si3N4 reactive system

M. Nomura, C. Iwamoto, S. I. Tanaka

Research output: Contribution to journalArticlepeer-review

66 Citations (Scopus)


Nanometer scale structures around wetting triple lines were studied in a Ag-Cu-Ti/Si3N4 reactive system. Changes in the contact angle and radius of the molten metal on the substrate as a function of time were also measured in the system as macroscopic wetting behaviors. The macroscopic wetting behaviors showed two wetting stages and double layered reaction products consisting of upper Ti5Si3 and lower TiN layers were observed in both first and second stages. The reaction product always lay in front of the triple line defined as a triple junction of Ag - Cu - Ti alloy/Ti5Si3/atmosphere. At the front of the reaction product, a dominant phase changed from TiN in the first stage to Ti5Si3 in the second stage. It is considered that the structural change is one of the reasons why the macroscopic wetting behavior changed, and that the structural change was caused by a decrease of Ti activity as the reactive wetting progressed.

Original languageEnglish
Pages (from-to)407-413
Number of pages7
JournalActa Materialia
Issue number2
Publication statusPublished - 1999
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys


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