Nanoporous gold for MEMS packing applications

Yu Ching Lin, Wei Shan Wang, Lu Yang Chen, Ming Wei Chen, Thomas Gessner, Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

On-chip nanoporous gold (NPG) fabrication has been successfully developed by Au-Sn alloys electrodeposition and dealloying process, to use its compressible body and nanostructured surface for micro electro mechanical systems (MEMS) applications. Anodically-bondable low temperature cofired ceramic (LTCC) substrates are proposed to provide electrical connective packaging by using novel nano-structured gold. The porous structure offers sponge-like functions which forms electrical contacts as well during anodic bonding. Nanoporous gold with porosity in nanoscale indicates a highly reactive surface which makes it possible to be a promising candidate for bonding process to reduce the bonding temperature. Low temperature bonding has been achieved by using nanoporous gold. These encouraging results imply good possibilities of nanoporous gold for MEMS packaging applications.

Original languageEnglish
Pages (from-to)31-36
Number of pages6
JournalIEEJ Transactions on Sensors and Micromachines
Volume133
Issue number2
DOIs
Publication statusPublished - 2013

Keywords

  • Anodic bonding
  • LTCC
  • Low temperature bonding
  • MEMS packaging
  • Nanoporous gold

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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