Nanoporous gold as a versatile bonding intermediate

Y. C. Lin; W. S. Wang; T. Gessner; M. Esashi

doi:10.1109/LTB-3D.2014.6886185

Nanoporous gold as a versatile bonding intermediate

Y. C. Lin, W. S. Wang, T. Gessner, M. Esashi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.

Original language	English
Title of host publication	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Publisher	IEEE Computer Society
Pages	46
Number of pages	1
ISBN (Print)	9781479952618
DOIs	https://doi.org/10.1109/LTB-3D.2014.6886185
Publication status	Published - 2014
Event	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan Duration: 2014 Jul 15 → 2014 Jul 16

Publication series

Name	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Other

Other	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Country/Territory	Japan
City	Tokyo
Period	14/7/15 → 14/7/16

ASJC Scopus subject areas

Filtration and Separation

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10.1109/LTB-3D.2014.6886185

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Lin, Y. C., Wang, W. S., Gessner, T., & Esashi, M. (2014). Nanoporous gold as a versatile bonding intermediate. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 (pp. 46). [6886185] (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886185

Nanoporous gold as a versatile bonding intermediate. / Lin, Y. C.; Wang, W. S.; Gessner, T.; Esashi, M.

Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 2014. p. 46 6886185 (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lin, YC, Wang, WS, Gessner, T & Esashi, M 2014, Nanoporous gold as a versatile bonding intermediate. in Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014., 6886185, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, IEEE Computer Society, pp. 46, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan, 14/7/15. https://doi.org/10.1109/LTB-3D.2014.6886185

Lin YC, Wang WS, Gessner T, Esashi M. Nanoporous gold as a versatile bonding intermediate. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society. 2014. p. 46. 6886185. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). https://doi.org/10.1109/LTB-3D.2014.6886185

@inproceedings{5b54d16f5071404393c299b74d4fdfdf,

title = "Nanoporous gold as a versatile bonding intermediate",

abstract = "On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.",

author = "Lin, {Y. C.} and Wang, {W. S.} and T. Gessner and M. Esashi",

year = "2014",

doi = "10.1109/LTB-3D.2014.6886185",

language = "English",

isbn = "9781479952618",

series = "Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014",

publisher = "IEEE Computer Society",

pages = "46",

booktitle = "Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014",

note = "2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 ; Conference date: 15-07-2014 Through 16-07-2014",

}

TY - GEN

T1 - Nanoporous gold as a versatile bonding intermediate

AU - Lin, Y. C.

AU - Wang, W. S.

AU - Gessner, T.

AU - Esashi, M.

PY - 2014

Y1 - 2014

N2 - On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.

AB - On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.

UR - http://www.scopus.com/inward/record.url?scp=84906988585&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84906988585&partnerID=8YFLogxK

U2 - 10.1109/LTB-3D.2014.6886185

DO - 10.1109/LTB-3D.2014.6886185

M3 - Conference contribution

AN - SCOPUS:84906988585

SN - 9781479952618

T3 - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

SP - 46

BT - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

PB - IEEE Computer Society

T2 - 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Y2 - 15 July 2014 through 16 July 2014

ER -

Nanoporous gold as a versatile bonding intermediate

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