Nanoporous gold as a versatile bonding intermediate

Y. C. Lin; W. S. Wang; T. Gessner; Masayoshi Esashi

doi:10.1109/LTB-3D.2014.6886185

Nanoporous gold as a versatile bonding intermediate

Y. C. Lin, W. S. Wang, T. Gessner, Masayoshi Esashi

Micro System Integration Center (μSIC)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.

Original language	English
Title of host publication	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Publisher	IEEE Computer Society
Number of pages	1
ISBN (Print)	9781479952618
DOIs	https://doi.org/10.1109/LTB-3D.2014.6886185
Publication status	Published - 2014 Jan 1
Event	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan Duration: 2014 Jul 15 → 2014 Jul 16

Other

Other	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Country	Japan
City	Tokyo
Period	14/7/15 → 14/7/16

ASJC Scopus subject areas

Filtration and Separation

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Lin, YC, Wang, WS, Gessner, T & Esashi, M 2014, Nanoporous gold as a versatile bonding intermediate. in Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014., 6886185, IEEE Computer Society, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan, 14/7/15. https://doi.org/10.1109/LTB-3D.2014.6886185

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abstract = "On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.",

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AB - On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.

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BT - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

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Y2 - 15 July 2014 through 16 July 2014

ER -

Nanoporous gold as a versatile bonding intermediate

Abstract

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