Abstract
On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.
Original language | English |
---|---|
Title of host publication | Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 |
Publisher | IEEE Computer Society |
Number of pages | 1 |
ISBN (Print) | 9781479952618 |
DOIs | |
Publication status | Published - 2014 Jan 1 |
Event | 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan Duration: 2014 Jul 15 → 2014 Jul 16 |
Other
Other | 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 |
---|---|
Country | Japan |
City | Tokyo |
Period | 14/7/15 → 14/7/16 |
ASJC Scopus subject areas
- Filtration and Separation