Nanometer-scale period Sc/Cr multilayer mirrors and their thermal stability

E. Majkova, Y. Chushkin, M. Jergel, S. Luby, V. Holy, I. Matko, B. Chenevier, L. Toth, T. Hatano, M. Yamamoto

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Abstract

Results of comprehensive characterization of Sc/Cr multilayers for soft X-ray mirrors working in the water window range (2.4-4.4 nm) are presented. Multilayer samples were prepared by ion beam sputtering with up to 250 periods in a range of 1.3-1.75 nm. They were analyzed by transmission electron microscopy (TEM), high resolution TEM, X-ray diffractometry, specular X-ray scattering and diffuse X-ray scattering. The TEM inspection showed good periodicity of the multilayer structure. From simulation studies of the specular reflectivity and a reciprocal space map of the diffuse scattering, it follows that the effective roughness of interfaces is 0.25-0.28 nm, being equal to the geometrical roughness data. Lateral and vertical correlation lengths of the roughness are 7 and 35 nm, respectively. Heat treatment study of the Sc/Cr multilayers revealed a reasonable thermal stability. An increase of the multilayer period of 2.4% was observed after 33 h annealing at 280 °C and a considerable decrease of reflectivity followed above 300 °C annealing for 3 h, which corresponds to the low mutual miscibility between Sc and Cr.

Original languageEnglish
Pages (from-to)115-120
Number of pages6
JournalThin Solid Films
Volume497
Issue number1-2
DOIs
Publication statusPublished - 2006 Feb 21

Keywords

  • Grazing incidence X-ray scattering
  • Interface roughness
  • Multilayers
  • Thermal stability

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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  • Cite this

    Majkova, E., Chushkin, Y., Jergel, M., Luby, S., Holy, V., Matko, I., Chenevier, B., Toth, L., Hatano, T., & Yamamoto, M. (2006). Nanometer-scale period Sc/Cr multilayer mirrors and their thermal stability. Thin Solid Films, 497(1-2), 115-120. https://doi.org/10.1016/j.tsf.2005.10.051