We have investigated a resist-trimming process for SAL601 chemically amplified negative electron beam resist. Ultra-fine SAL601 resist patterns with a width of 16nm were obtained by an isotropic trimming process in oxygen plasma. This pattern resolution in SAL601 could not be obtained through direct electron beam lithography alone. Using the trimmed electron beam resists, we have successfully fabricated ultra-fine poly-silicon patterns of less than 20nm width. We applied this nanolithography technique to fabricating an ultra-small metal-oxide-semiconductor field-effect-transistor (MOSFET) and revealed that this trimming process is a useful method for nanometer-scale silicon device fabrication.
|Journal||Materials Research Society Symposium-Proceedings|
|Publication status||Published - 2001 Jan 1|
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering