Nanocomposite epoxy resin for SiC module

Kenji Okamoto, Yuji Takematsu, Miyako Hitomi, Yoshinari Ikeda, Yoshikazu Takahashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

There is a demand to improve the thermal stability of epoxy molding resins used in the power module of SiC power chips operating at temperatures of 200°C or more. This paper describes a technique for increasing the thermal stability of the resin by decreasing molecular motion through the addition of nanofiller. The experimental results showed that the glass transition temperature (Tg) of the epoxy resin increased by approximately 30°C when the silica nanofiller was added. The epoxy resin added nanofiller was investigated in order to achieve the operation temperature 200°C of power module.

Original languageEnglish
Title of host publicationProceedings - 2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011
Pages196-200
Number of pages5
Publication statusPublished - 2011 Dec 1
Externally publishedYes
Event2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011 - Oxford, United Kingdom
Duration: 2011 Jul 182011 Jul 20

Publication series

NameProceedings - 2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011

Other

Other2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011
Country/TerritoryUnited Kingdom
CityOxford
Period11/7/1811/7/20

Keywords

  • Epoxy molding resin
  • Nanofiller
  • Packaging
  • Sic power module

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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