@inproceedings{efa250fc6d354ec9bd200de675476997,
title = "Nanocomposite epoxy resin for SiC module",
abstract = "There is a demand to improve the thermal stability of epoxy molding resins used in the power module of SiC power chips operating at temperatures of 200°C or more. This paper describes a technique for increasing the thermal stability of the resin by decreasing molecular motion through the addition of nanofiller. The experimental results showed that the glass transition temperature (Tg) of the epoxy resin increased by approximately 30°C when the silica nanofiller was added. The epoxy resin added nanofiller was investigated in order to achieve the operation temperature 200°C of power module.",
keywords = "Epoxy molding resin, Nanofiller, Packaging, Sic power module",
author = "Kenji Okamoto and Yuji Takematsu and Miyako Hitomi and Yoshinari Ikeda and Yoshikazu Takahashi",
year = "2011",
month = dec,
day = "1",
language = "English",
isbn = "0930815939",
series = "Proceedings - 2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011",
pages = "196--200",
booktitle = "Proceedings - 2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011",
note = "2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011 ; Conference date: 18-07-2011 Through 20-07-2011",
}