Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications

Kanuku Ri, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with 80μm height is around 30 mΩ for each pair of 10μm electrode diameter. Normalized capacitance of CNP bundle with 80μm height is 0.2 fF per μm wire length.

Original languageEnglish
Title of host publication2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509013999
DOIs
Publication statusPublished - 2017 Jul 5
Event2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 - San Francisco, United States
Duration: 2016 Nov 82016 Nov 11

Publication series

Name2016 IEEE International 3D Systems Integration Conference, 3DIC 2016

Other

Other2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
CountryUnited States
CitySan Francisco
Period16/11/816/11/11

Keywords

  • Cu nano-pillar (CNP)
  • exascale 2.5D/3D integration
  • nano-scale Cu direct bonding

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electronic, Optical and Magnetic Materials
  • Computer Networks and Communications

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