Multiwavelength DFB-LD array module using self-aligned solder bump bonding

N. Suzuki; Y. Muroya; J. Sasaki; H. Yamada; T. Torikai

Multiwavelength DFB-LD array module using self-aligned solder bump bonding

N. Suzuki, Y. Muroya, J. Sasaki, H. Yamada, T. Torikai

Research output: Contribution to journal › Conference article › peer-review

Abstract

Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.

Original language	English
Pages (from-to)	212-215
Number of pages	4
Journal	IEE Conference Publication
Issue number	448 /2
Publication status	Published - 1997 Dec 1
Externally published	Yes
Event	Proceedings of the 1997 11th International Conference on Integrated Optics and Optical Fibre Communications and 23rd European Conference on Optical Communications, IOOC-ECOC'97. Part 2 (of 5) - Duration: 1997 Sep 22 → 1997 Sep 25

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

@article{abff13eb4c5f46d9bf7ddd7e2f5600b1,

title = "Multiwavelength DFB-LD array module using self-aligned solder bump bonding",

abstract = "Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.",

author = "N. Suzuki and Y. Muroya and J. Sasaki and H. Yamada and T. Torikai",

year = "1997",

month = dec,

day = "1",

language = "English",

pages = "212--215",

journal = "IEE Conference Publication",

issn = "0537-9989",

publisher = "Institution of Engineering and Technology",

number = "448 /2",

note = "Proceedings of the 1997 11th International Conference on Integrated Optics and Optical Fibre Communications and 23rd European Conference on Optical Communications, IOOC-ECOC'97. Part 2 (of 5) ; Conference date: 22-09-1997 Through 25-09-1997",

}

TY - JOUR

T1 - Multiwavelength DFB-LD array module using self-aligned solder bump bonding

AU - Suzuki, N.

AU - Muroya, Y.

AU - Sasaki, J.

AU - Yamada, H.

AU - Torikai, T.

PY - 1997/12/1

Y1 - 1997/12/1

N2 - Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.

AB - Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.

UR - http://www.scopus.com/inward/record.url?scp=0031333064&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031333064&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0031333064

SP - 212

EP - 215

JO - IEE Conference Publication

JF - IEE Conference Publication

SN - 0537-9989

IS - 448 /2

T2 - Proceedings of the 1997 11th International Conference on Integrated Optics and Optical Fibre Communications and 23rd European Conference on Optical Communications, IOOC-ECOC'97. Part 2 (of 5)

Y2 - 22 September 1997 through 25 September 1997

ER -

Multiwavelength DFB-LD array module using self-aligned solder bump bonding

Abstract

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this