Multiwavelength DFB-LD array module using self-aligned solder bump bonding

N. Suzuki, Y. Muroya, J. Sasaki, H. Yamada, T. Torikai

Research output: Contribution to journalConference article

2 Citations (Scopus)

Abstract

Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.

Original languageEnglish
Pages (from-to)212-215
Number of pages4
JournalIEE Conference Publication
Issue number448 /2
Publication statusPublished - 1997 Dec 1
Externally publishedYes
EventProceedings of the 1997 11th International Conference on Integrated Optics and Optical Fibre Communications and 23rd European Conference on Optical Communications, IOOC-ECOC'97. Part 2 (of 5) -
Duration: 1997 Sep 221997 Sep 25

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Suzuki, N., Muroya, Y., Sasaki, J., Yamada, H., & Torikai, T. (1997). Multiwavelength DFB-LD array module using self-aligned solder bump bonding. IEE Conference Publication, (448 /2), 212-215.