Abstract
Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.
| Original language | English |
|---|---|
| Pages (from-to) | 212-215 |
| Number of pages | 4 |
| Journal | IEE Conference Publication |
| Issue number | 448 /2 |
| Publication status | Published - 1997 Dec 1 |
| Externally published | Yes |
| Event | Proceedings of the 1997 11th International Conference on Integrated Optics and Optical Fibre Communications and 23rd European Conference on Optical Communications, IOOC-ECOC'97. Part 2 (of 5) - Duration: 1997 Sep 22 → 1997 Sep 25 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
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Cite this
Suzuki, N., Muroya, Y., Sasaki, J., Yamada, H., & Torikai, T. (1997). Multiwavelength DFB-LD array module using self-aligned solder bump bonding. IEE Conference Publication, (448 /2), 212-215.